4-55. + The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2050 and 0.2150 micrometers. Determine the following: (a) Cumulative distribution function of photoresist thickness (b) Proportion of wafers that exceeds 0.2125 micrometers in photoresist thickness (c) Thickness exceeded by $10 \%$ of the wafers (d) Mean and variance of photoresist thickness

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